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Short Description:

Boyad Part Number :544-3135-ND
manufacturer: Intel
Manufacturer product number :10M08SAU169C8G
describe :IC FPGA 130 I/O 169UBGA
Detailed Description: series Field Programmable Gate Array (FPGA) IC 130 387072 8000 169-LFBGA
Customer Internal Part Number
Specifications: Specifications


Product Detail

Product Tags

product properties

TYPE DESCRIBE
category Integrated Circuit (IC)
Embedded - FPGA (Field Programmable Gate Array)
manufacturer Intel
series MAX® 10
Package tray
product status in stock
Number of LAB/CLB 500
Number of logic elements/units 8000
Total RAM bits 387072
I/O count 130
Voltage - Powered 2.85V ~ 3.465V
installation type Surface Mount Type
Operating temperature 0°C ~ 85°C (TJ)
Package/Enclosure 169-LFBGA
Supplier Device Packaging 169-UBGA (11x11)

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Documentation and Media

RESOURCE TYPE LINK
Specifications MAX 10 FPGA Overview MAX 10 FPGA Device Datasheet
Product training modules MAX10 Motor Control using a Single-Chip Low-Cost Non-Volatile FPGA  MAX10 Based System Management
Featured Products T-Core PlatformEvo M51 Compute Module Hinj™ FPGA Sensor Hub and Development Kit XLR8: Arduino Compatible FPGA Development Board
PCN Design/Specification Max10 Pin Guide 3/Dec/2021Mult Dev Software Chgs 3/Jun/2021
PCN package Mult Dev Label Chgs 24/Feb/2020Mult Dev Label CHG 24/Jan/2020
HTML Specifications MAX 10 FPGA OverviewMAX 10 FPGA Device Datasheet
EDA/CAD model 10M08SAU169C8G by SnapEDA

Environment and Export Classification

ATTRIBUTES DESCRIBE
RoHS status RoHS compliant
Moisture Sensitivity Level (MSL) 3 (168 hours)
REACH status Non-REACH products
ECCN 3A991D
HTSUS 8542.39.0001

Embedded Multipliers and Digital Signal Processing Support
Up to 17 single-ended external inputs
for single ADC devices
One dedicated analog and 16 dual function input pins
Up to 18 single-ended external inputs
for dual ADC devices
• One dedicated analog and eight dual-function input pins in each ADC block
• Simultaneous measurement capability for dual ADC devices
On-chip temperature sensor Monitors external temperature data input with a sampling rate of up to 50
kilosamples per second
User Flash Memory
The user flash memory (UFM) block in Intel MAX 10 devices stores non-volatile
information.
UFM provides an ideal storage solution that you can access using Avalon MemoryMapped (Avalon-MM) slave interface protocol.
Embedded Multipliers and Digital Signal Processing Support
Intel MAX 10 devices support up to 144 embedded multiplier blocks. Each block
supports one individual 18 × 18-bit multiplier or two individual 9 × 9-bit multipliers.
With the combination of on-chip resources and external interfaces in Intel MAX 10
devices, you can build DSP systems with high performance, low system cost, and low
power consumption.
You can use the Intel MAX 10 device on its own or as a DSP device co-processor to
improve price-to-performance ratios of DSP systems.
You can control the operation of the embedded multiplier blocks using the following
options:
• Parameterize the relevant IP cores with the Intel Quartus Prime parameter editor
• Infer the multipliers directly with VHDL or Verilog HDL
System design features provided for Intel MAX 10 devices:
• DSP IP cores:
— Common DSP processing functions such as finite impulse response (FIR), fast
Fourier transform (FFT), and numerically controlled oscillator (NCO) functions
— Suites of common video and image processing functions
• Complete reference designs for end-market applications
• DSP Builder for Intel FPGAs interface tool between the Intel Quartus Prime
software and the MathWorks Simulink and MATLAB design environments
• DSP development kits
Embedded Memory Blocks
The embedded memory structure consists of M9K memory blocks columns. Each M9K
memory block of a Intel MAX 10 device provides 9 Kb of on-chip memory capable of
operating at up to 284 MHz. The embedded memory structure consists of M9K
memory blocks columns. Each M9K memory block of a Intel MAX 10 device provides
9 Kb of on-chip memory. You can cascade the memory blocks to form wider or deeper
logic structures.
You can configure the M9K memory blocks as RAM, FIFO buffers, or ROM.
The Intel MAX 10 device memory blocks are optimized for applications such as high
throughput packet processing, embedded processor program, and embedded data
storage.


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