product properties：
| TYPE | DESCRIBE |
| category | Integrated Circuit (IC) Embedded - Microcontrollers |
| manufacturer | NXP USA Inc. |
| series | MPC56xx Qorivva |
| Package | tray |
| product status | in stock |
| core processor | e200z0h |
| Kernel specification | 32-bit single core |
| speed | 64MHz |
| Connectivity | CANbus，I²C，LIN，SCI，SPI |
| Peripherals | DMA ， POR ， PWM ， WDT |
| Number of I / O | 79 |
| Program storage capacity | 512KB（512K x 8） |
| Program memory type | flash |
| EEPROM capacity | 64K x 8 |
| RAM size | 32K x 8 |
| Voltage - Power Supply (Vcc/Vdd) | 3V ~ 5.5V |
| data converter | A/D 28x10b |
| Oscillator Type | internal |
| Operating temperature | -40°C ~ 85°C (TA) |
| installation type | Surface Mount Type |
| Package/Enclosure | 100-LQFP |
| Supplier Device Packaging | 100-LQFP（14x14） |
| Basic product number | SPC5604 |
Environment and Export Classification:
| ATTRIBUTES | DESCRIBE |
| RoHS status | Compliant with ROHS3 specification |
| Moisture Sensitivity Level (MSL) | 3 (168 hours) |
| REACH status | Non-REACH products |
| ESCAPE | 3A991A2 |
| HTSUS | 8542.31.0001 |
Features:
• Single issue, 32-bit CPU core complex (e200z0)
– Compliant with the Power Architecture® embedded
category
– Includes an instruction set enhancement allowing
variable length encoding (VLE) for code size footprint
reduction. With the optional encoding of mixed 16-bit
and 32-bit instructions, it is possible to achieve
significant code size footprint reduction.
• Up to 512 KB on-chip code flash supported with the flash
controller and ECC
• 64 (4 × 16) KB on-chip data flash memory with ECC
• Up to 48 KB on-chip SRAM with ECC
• Memory protection unit (MPU) with 8 region descriptors
and 32-byte region granularity
• Interrupt controller (INTC) with 148 interrupt vectors,
including 16 external interrupt sources and 18 external
interrupt/wakeup sources
• Frequency modulated phase-locked loop (FMPLL)
• Crossbar switch architecture for concurrent access to
peripherals, flash memory, or RAM from multiple bus
masters
• Boot assist module (BAM) supports internal flash
programming via a serial link (CAN or SCI)
• Timer supports input/output channels providing a range of
16-bit input capture, output compare, and pulse width
modulation functions (eMIOS-lite)
• 10-bit analog-to-digital converter (ADC)
• 3 serial peripheral interface (DSPI) modules
• Up to 4 serial communication interface (LINFlex)
Modules
• Up to 6 enhanced full CAN (FlexCAN) modules with
configurable buffers
• 1 inter IC communication interface (I2C) module
• Up to 123 configurable general purpose pins supporting
input and output operations (package dependent)
• Real Time Counter (RTC) with clock source from128 kHz
or 16 MHz internal RC oscillator supporting autonomous
wakeup with 1 ms resolution with max timeout of 2
seconds
• Up to 6 periodic interrupt timers (PIT) with 32-bit counter
resolution
• 1 System Module Timer (STM)
• Nexus development interface (NDI) per IEEE-ISTO
5001-2003 Class Two Plus standard
• Device/board boundary Scan testing supported with per
Joint Test Action Group (JTAG) of IEEE (IEEE 1149.1)
• On-chip voltage regulator (VREG) for regulation of
input supply for all internal levels.
