product properties
TYPE
DESCRIBE
category
Integrated Circuit (IC)
Embedded – System on a Chip (SoC)
manufacturer
AMD Xilinx
series
Zynq® UltraScale+™ MPSoC CG
Package
tray
Product Status
in stock
Architecture
MCU, FPGA
core processor
Dual Core ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual Core ARM® Cortex™-R5 with CoreSight™
Flash size
-
RAM size
256KB
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
speed
533MHz, 1.3GHz
main attribute
Zynq® UltraScale+™ FPGA, 103K+ logic cells
operating temperature
-40°C ~ 100°C (TJ)
Package/Enclosure
784-BFBGA, FCBGA
Supplier Device Packaging
784-FCBGA (23×23)
I/O count
252
Basic product number
XCZU2
Media and Downloads
RESOURCE TYPE
LINK
Specifications
Zynq UltraScale+ MPSoC Overview
Environmental information
Xiliinx RoHS Certificate
Xilinx REACH211 Cert
EDA/CAD model
XCZU2CG-2SFVC784I by SnapEDA
Environment and Export Classification
ATTRIBUTES
DESCRIBE
RoHS status
Compliant with ROHS3 specification
Moisture Sensitivity Level (MSL)
4 (72 hours)
REACH status
Non-REACH products
ECCN
5A002A4 XIL
HTSUS
8542.39.0001
