product properties
TYPE
DESCRIBE
category
Integrated Circuit (IC)
Memory – Configuration PROM for FPGA
manufacturer
AMD Xilinx
series
-
Package
pipe fittings
Product Status
discontinued
Programmable type
Programmable in the system
storage
1Mb
Voltage – Powered
3V ~ 3.6V
operating temperature
-40°C ~ 85°C
installation type
Surface Mount Type
Package/Enclosure
20-TSSOP (0.173″, 4.40mm wide)
Supplier Device Packaging
20-TSSOP
Basic product number
XCF01
Media and Downloads
RESOURCE TYPE
LINK
Specifications
XCFxx(S,P) Platform Flash PROMS
Environmental information
Xilinx REACH211 Cert
Xiliinx RoHS Certificate
PCN Product Change/Discontinuation
Mult Dev EOL 17/May/2021
End of Life 10/JAN/2022
PCN Assembly/Source
Location Chg 22/Feb/2016
Environment and Export Classification
ATTRIBUTES
DESCRIBE
RoHS status
Compliant with ROHS3 specification
Moisture Sensitivity Level (MSL)
3 (168 hours)
REACH status
Non-REACH products
ECCN
3A991B1B2
HTSUS
8542.32.0071
