product properties
TYPE
DESCRIBE
category
Integrated Circuit (IC)
Embedded – System on a Chip (SoC)
manufacturer
AMD Xilinx
series
Automotive, AEC-Q100, Zynq®-7000 XA
Package
tray
Product Status
in stock
Architecture
MCU, FPGA
core processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash size
-
RAM size
256KB
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
speed
667MHz
main attribute
Artix™-7 FPGA, 28K logic cells
operating temperature
-40°C ~ 100°C (TJ)
Package/Enclosure
400-LFBGA, CSPBGA
Supplier Device Packaging
400-CSPBGA (17×17)
I/O count
130
Media and Downloads
RESOURCE TYPE
LINK
Specifications
XA Zynq-7000 Overview
Zynq-7000 SoC Specification
Environmental information
Xiliinx RoHS Certificate
Xilinx REACH211 Cert
HTML Specifications
Zynq-7000 SoC Specification
XA Zynq-7000 Overview
Environment and Export Classification
ATTRIBUTES
DESCRIBE
RoHS status
Compliant with ROHS3 specification
Moisture Sensitivity Level (MSL)
4 (72 hours)
REACH status
Non-REACH products
ECCN
EAR99
HTSUS
8542.39.0001