On September 9, local time, Intel CEO Kissinger announced that he would invest $20 billion to build a new large-scale wafer factory in Ohio, the United States. This is part of Intel’s IDM 2.0 strategy. The entire investment plan is as high as $100 billion. The new factory is expected to be mass-produced in 2025. At that time, the “1.8nm” process will return Intel to the semiconductor leader position.
Since becoming Intel CEO in February last year, Kissinger has vigorously promoted the construction of factories in the United States and around the world, of which at least US $40 billion has been invested in the United States. Last year, he has invested US $20 billion in Arizona to build a wafer factory. This time, he also invested US $20 billion in Ohio, and also built a new sealing and testing factory in New Mexico.
Intel invests another 20 billion dollars to build two chip factories. The king of “1.8nm” technology returns
The Intel factory is also a large semiconductor chip factory newly built in the United States after the passage of the chip subsidy bill of 52.8 billion US dollars. For this reason, the president of the United States also attended the commencement ceremony, as well as the governor of Ohio and other senior officials of local departments.
Intel invests another 20 billion dollars to build two chip factories. The king of “1.8nm” technology returns
Intel’s chip manufacturing base will be composed of two wafer factories, which can accommodate up to eight factories and supporting ecological support systems. It covers an area of nearly 1000 acres, that is, 4 square kilometers. It will create 3000 high-paid jobs, 7000 construction jobs, and tens of thousands of supply chain cooperation jobs.
These two wafer factories are expected to produce in mass in 2025. Intel did not specifically mention the process level of the factory, but Intel said previously that it would master the 5-generation CPU process within 4 years, and it would mass produce the 20a and 18a two generation processes in 2024. Therefore, the factory here should also produce the 18a process by that time.
20a and 18a are the world’s first chip processes to reach the EMI level, equivalent to the 2nm and 1.8nm processes of friends. They will also launch two Intel black technology technologies, ribbon FET and powervia.
According to Intel, ribbonfet is Intel’s implementation of gate all around transistors. It will become the first brand-new transistor architecture since the company first launched FinFET in 2011. This technology speeds up the switching speed of the transistor and achieves the same driving current as the multi fin structure, but takes up less space.
Powervia is Intel’s unique and the industry’s first back power transmission network, which optimizes signal transmission by eliminating the need for powersupply and
Post time: Sep-12-2022