parameter:
| parameter name | attribute value |
| Is Rohs certified? | meets the |
| Trade Names | XILINX (Xilinx) |
| Reach Compliance Code | compli |
| ECCN code | 3A991.D |
| maximum clock frequency | 667 MHz |
| JESD-30 code | S-PBGA-B484 |
| JESD-609 code | e1 |
| Humidity Sensitivity Level | 3 |
| number of entries | 338 |
| Number of logical units | 147443 |
| Output times | 338 |
| Number of terminals | 484 |
| Package body material | PLASTIC/EPOXY |
| package code | FBGA |
| Encapsulate equivalent code | BGA484,22X22,32 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 1.2,1.2/3.3,2.5/3.3 V |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | CMOS |
| Terminal surface | TIN SILVER COPPER |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
General Description :
Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor,
cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding
high-performance applications. The 7 series FPGAs include:
• Spartan®-7 Family: Optimized for low cost, lowest power, and high
I/O performance. Available in low-cost, very small form-factor
packaging for smallest PCB footprint.
• Artix®-7 Family: Optimized for low power applications requiring serial
transceivers and high DSP and logic throughput. Provides the lowest
total bill of materials cost for high-throughput, cost-sensitive
applications.
• Kintex®-7 Family: Optimized for best price-performance with a 2X
improvement compared to previous generation, enabling a new class
of FPGAs.
• Virtex®-7 Family: Optimized for highest system performance and
capacity with a 2X improvement in system performance. Highest
capability devices enabled by stacked silicon interconnect (SSI)
technology.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an
unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less
power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
Summary of 7 Series FPGA Features
• Advanced high-performance FPGA logic based on real 6-input look
up table (LUT) technology configurable as distributed memory.
• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data
buffering.
• High-performance SelectIO™ technology with support for DDR3
interfaces up to 1,866 Mb/s.
• High-speed serial connectivity with built-in multi-gigabit transceivers
from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a
special low-power mode, optimized for chip-to-chip interfaces.
• A user configurable analog interface (XADC), incorporating dual
12-bit 1MSPS analog-to-digital converters with on-chip thermal and
supply sensors.
• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder
for high-performance filtering, including optimized symmetric
coefficient filtering.
• Powerful clock management tiles (CMT), combining phase-locked
loop (PLL) and mixed-mode clock manager (MMCM) blocks for high
precision and low jitter.
• Quickly deploy embedded processing with MicroBlaze™ processor.
• Integrated block for PCI Express® (PCIe), for up to x8 Gen3
Endpoint and Root Port designs.
• Wide variety of configuration options, including support for
commodity memories, 256-bit AES encryption with HMAC/SHA-256
authentication, and built-in SEU detection and correction.
• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip
chip packaging offering easy migration between family members in
the same package. All packages available in Pb-free and selected
packages in Pb option.
• Designed for high performance and lowest power with 28 nm,
HKMG, HPL process, 1.0V core voltage process technology and
0.9V core voltage option for even lower power.
